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Faraday FPGA-Go-ASIC™ hits the market
2023-07-14
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【Hsinchu, Taiwan】November 22, 2022
Faraday Technology Corporation (TAX: 3035), a leading provider of application specific integrated circuit (ASIC) design services and design assets (IP), has announced that its FPGA-Go-ASIC™ service will be used for industrial and medical applications, smart grids, musical instruments, and more. and 5G wireless design applications spanning 55-22nm technologies.
This service significantly reduced the project's total manufacturing cost and power consumption, strengthening its market competitiveness. This includes some projects designed to be fully pin-to-pin compatible with existing FPGA chips.
Faraday's decades of SoC and IP design experience and expertise in complex architectures involving billions of gates enable Faraday to efficiently transform FPGAs from embedded ARM or RISC-V CPUs to fully usable ASICs or SoCs. has the capacity to The FPGA-Go-ASIC service can reduce chip costs by adopting optimized process technology and custom IP configurations to meet required performance specifications. For example, many FinFET-based FPGAs can be converted to 40nm or 28nm planar with ASICs. In addition, by integrating multiple FPGAs into a single ASIC that provides various functions, manufacturing cost, PCB size and power consumption can be significantly reduced.
Flash Lin, COO of Faraday, said, “ASICs in standard cell circuits offer superior performance compared to FPGAs in LUT-based circuits without redundant circuitry.” With our in-house IP portfolio, we can reduce the risk of chip integration and shorten time-to-market.” "Faraday expects that this solution will contribute to the successful market activities of its customers through long-term supply agreements."
Faraday Technology Corporation (TAX: 3035), a leading provider of application specific integrated circuit (ASIC) design services and design assets (IP), has announced that its FPGA-Go-ASIC™ service will be used for industrial and medical applications, smart grids, musical instruments, and more. and 5G wireless design applications spanning 55-22nm technologies.
This service significantly reduced the project's total manufacturing cost and power consumption, strengthening its market competitiveness. This includes some projects designed to be fully pin-to-pin compatible with existing FPGA chips.
Faraday's decades of SoC and IP design experience and expertise in complex architectures involving billions of gates enable Faraday to efficiently transform FPGAs from embedded ARM or RISC-V CPUs to fully usable ASICs or SoCs. has the capacity to The FPGA-Go-ASIC service can reduce chip costs by adopting optimized process technology and custom IP configurations to meet required performance specifications. For example, many FinFET-based FPGAs can be converted to 40nm or 28nm planar with ASICs. In addition, by integrating multiple FPGAs into a single ASIC that provides various functions, manufacturing cost, PCB size and power consumption can be significantly reduced.
Flash Lin, COO of Faraday, said, “ASICs in standard cell circuits offer superior performance compared to FPGAs in LUT-based circuits without redundant circuitry.” With our in-house IP portfolio, we can reduce the risk of chip integration and shorten time-to-market.” "Faraday expects that this solution will contribute to the successful market activities of its customers through long-term supply agreements."